סקירה כללית
^^משרה זו נלקחה מ INDEED^^
Description
• HP is looking for a Yield Improvement Program Lead to join our global Reverse and Repair team. This role has significant impact on customer experience and Service P&L, leading technical process improvement initiatives across HP Indigo’s global Repair Centers, with a clear objective to increase yield, reduce scrap, and improve process robustness. Key responsibilities Lead structured, data‑driven initiatives to improve repair Yield and reduce Scrap across global Repair Centers. Analyze repair performance trends, identify systemic loss drivers, and define targeted improvement actions. Define and drive Yield improvement roadmaps by part family and technology, aligned with business priorities. Lead end‑to‑end investigations for recurring failures, chronic low‑yield parts, and abnormal scrap trends. Drive structured root cause analysis (A3 / 8D / RCA) at component, assembly, and process levels, distinguishing between design, process, handling, installation, and logistics causes. Identify non‑robust repair and installation steps and drive process simplification and mistake‑proofing. Improve repair procedures, work instructions, verification steps, and embedded control points to eliminate repeated failures. Build dashboards and structured reporting to track trends, root causes, and improvement effectiveness, translating data into clear management insights. Drive cross‑functional alignment with Repair Centers, Quality, R&D, Spare Parts Organization, and Suppliers, leading cross‑site task forces and ensuring corrective actions are implemented, validated, standardized, and sustained. Education, Skills, and experience B.SC in Mechanical Engineering, Electrical Engineering, or equivalent. 4
• 6 years in engineering, technical services, or manufacturing technologies
• must. Fluent in English (reading, writing, speaking)
• must . Very strong technical background with Spare Parts repair/refurbish
• advantage. Hands
• on experience with Printing industry
• advantage. Strong understanding of assemblies (drawings, BOM, wiring diagrams). Proven ability to lead complex activities, projects, and teams without formal authority. Experience with engineering processes: ECO, waivers, investigations. Knowledge with measurement, calibration methods, and use of inspection tools. Proficient in Microsoft Excel and PowerPoint. 10% travel The position is defined for a two
• year period with an option for extension #LIPOST Job
• Engineering Schedule
• Full time Shift
• No shift premium (Israel) Travel
• Relocation
• Equal Opportunity Employer (EEO)
• HP, Inc. provides equal employment opportunity to all employees and prospective employees, without regard to race, color, religion, sex, national origin, ancestry, citizenship, sexual orientation, age, disability, or status as a protected veteran, marital status, familial status, physical or mental disability, medical condition, pregnancy, genetic predisposition or carrier status, uniformed service status, political affiliation or any other characteristic protected by applicable national, federal, state, and local law(s). Please be assured that you will not be subject to any adverse treatment if you choose to disclose the information requested. This information is provided voluntarily. The information obtained will be kept in strict confidence. For more information, review HP’s EEO Policy or read about your rights as an applicant under the law here: “ Know Your Rights: Workplace Discrimination is Illegal "
דרישות המשרה
Lead structured, data‑driven initiatives to improve repair Yield and reduce Scrap across global Repair Centers. Analyze repair performance trends, identify systemic loss drivers, and define targeted improvement actions. Define and drive Yield improvement roadmaps by part family and technology, aligned with business priorities. Lead end‑to‑end investigations for recurring failures, chronic low‑yiel
