Senior IC Physical Failure Analysis Engineer

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NVIDIA Networking IC Product Engineering team is looking for a highly skilled IC physical failure analysis (PFA) engineer to join our growing team and support PFA activities for yield improvement, product bring
• up, customer returns, and product qualification. As a PFA engineer, you will own the physical failure analysis (PFA) part, develop work procedures/techniques/recipes, and perform PFA of IC’s using in
• house equipment and in external labs. What You Will Be Doing: Opera te dual
• beam PFIB and develop workflows for the following applications: Site
• specific cross
• sectioning TEM sample preparation IC delayer Large scale cross
• sections Unique sample preparation for different probing and imaging techniques Use SEM based nanoprobing techniques for fault isolation and device/cell characterization based on FA plan provided by the EFA engineers EBAC/EBIC/EBRICH for fault isolation Device and cell level measurements Own and lead nanoprobing activities, including method development and execution. Continuously drive improvements, stay up
• to date, and collaborate with vendors on new techniques. Sample preparation for optical fault isolation, probing and more: use P
• lapping and CNC for Si thinning and IC delayering What We Need to See: BSc in Materials/chemical engineering, physics, chemistry, or related fields 5+ years of relevant industry experience in IC package or die level Failure Analysis. Ability to work and collaborate as part of a team and independently Self
• motivated with the ability to learn alone and review the literature to find solutions to our challenges. Insist on high standards for high
• quality samples Good documentation and communication skills Ways To Stand Out From The Crowd: Good understanding of VLSI circuit design, and/or device physics, and/or IC process engineering Experience with various IC delayering methods Background with dual beam FIB for cross
• sections and preparing lamella for TEM Experience with SEM based nano
• probing

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